Quectel RM520-GL 5G Modem Qualcomm Snadragon X62

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$165.00 USD

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Model Quectel RM520-GL

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General Specifications

Parameter	Description
Chipset	Qualcomm Snapdragon X62 5G Modem-RF System (SDX62)
Form Factor	M.2 2242 B Key (30.0 mm × 52.0 mm × 2.3 mm)
Compatibility	Pin-compatible with Quectel RM50xQ 5G series, EM06/EM060K (Cat 6), EM12/EM12xR/EM120K (Cat 12), and EM160R-GL (Cat 16) for easy LTE-A to 5G upgrades
Operating Temperature	-40°C to +85°C (industrial-grade)
Power Supply	3.3V typical, peak current ~2A (in 5G mode)

Data Rates and Bandwidth

Parameter	Value
Downlink Peak	Up to 2.5 Gbps (4Rx 4Tx MIMO, 100 MHz bandwidth)
Uplink Peak	Up to 900 Mbps (2Rx 2Tx MIMO, 100 MHz bandwidth)
LTE Category	Fallback support for Cat 19 DL / Cat 13 UL (up to 1.6 Gbps DL / 200 Mbps UL)
Latency	Millisecond-level (R16 enhancements, supports 5G network slicing and ultra-reliable communication)

Supported Bands (Global Version -GL)

5G NR Sub-6GHz: n1/n2/n3/n5/n7/n8/n12/n20/n25/n28/n38/n40/n41/n66/n77/n78/n79
LTE FDD: B1/B2/B3/B4/B5/B7/B8/B12/B13/B18/B19/B20/B25/B26/B28/B66
LTE TDD: B34/B38/B39/B40/B41
WCDMA: B1/B2/B4/B5/B6/B8/B19
Coverage: Compatible with major global carriers (e.g., T-Mobile, Telstra, certified)

Interfaces and Features

Parameter	Description
Antenna Ports	4x Main (Rx 4x4 MIMO), 2x Auxiliary (Diversity), 1x GNSS antenna
USB Interface	USB 3.1 (up to 5 Gbps, supports MBIM, RNDIS, ECM, Serial)
PCIe Interface	PCIe Gen3 (up to 985 MB/s)
Other Interfaces	UART, I2C, I2S, SDIO 3.0, ADC, GPIO, Antenna Control
GNSS	Integrated, supports GPS/GLONASS/BeiDou/Galileo (Gen9C Lite)
Audio	PCM, I2S for VoLTE and audio applications